PIB Headquarters issued the Design Linked Incentive Scheme

Jan 07, 2026 | by TeamLease RegTech Legal Research Team

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Industry Specific ComplianceThe PIB Headquarters, on January 06, 2026, issued the Design Linked Incentive Scheme.

The following has been stated namely: -

• C-DAC has established the ChipIN Centre under the DLI Scheme to facilitate the design infrastructure support to approved companies::

• National EDA (Electronic Design Automation) Tool Grid: Remote access to the centralised facility of advanced EDA tools for chip design activities will be provided to start-ups and MSMEs.

• IP Core repository: Flexible access to the repository of IP Cores for SoC design activities.

• MPW Prototyping support: Fiscal support for fabricating the design in an MPW manner at semiconductor foundries.

• Post-silicon validation support: Fiscal support for testing and validation of the fabricated ASIC and silicon bring-up activities.

• The Design Linked Incentive (DLI) Scheme is critical to anchoring India in the most strategic and value-intensive segment of the global semiconductor value chain—chip design. By reducing dependence on imported semiconductor IPs and chips, strengthening resilience against geopolitical and supply-chain disruptions, and ensuring assured access to critical technologies for defence, telecom, AI and mobility, DLI lays the foundation for strategic autonomy and long-term economic growth. The scheme also enables high-value growth by translating deep-tech innovation into globally competitive products, fostering startups and MSMEs, and building a highly skilled engineering workforce.

[Press release no. 2211220]


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